Module Information


Model: RC-TASK2-868


ASK/OOK transmitter module with Crystal oscillator.


Vdc: 2.2 ÷ 3.6Volt

Current:  21/15mA

Frequency: 868.30MHz​

Power : 10dBm

Dimension: 20.32 x 11.43mm 

Model: RC-TFSK3-434


433.92MHz FSK Radio Transmitter Module - Standard Pinout .



Vdc: 2.4 ÷ 3.6Volt

Current: 14.5m

Frequency: 433.92MHz

Powe : 10dBm

Dimension: 20.32 x 11.43mm


Model: RC-TFSK4-434

Description :

433.92MHz FSK Transmitter Module - Standard Pinout.



Vdc: 2.4 ÷ 3.6Volt

Current: 14.5mA

Frequency: 433.92MHz

Power :  10dBm

Dimension: 30.5 x 10.3mm

Reference Schematics






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Thick Film Tecnology Service

© 2021 RadioControlli S.r.l.  VAT IT03939360610 All right reserved.

thick film technology

Custom circuits in thick film technology

The Hybrid Circuits technology uses a ceramic substrate on which are deposited, by screen printing and subsequent sintering, several layers of conductive, dielectric and resistive materials that together form the passive part of the circuit. The metals commonly used are silver, gold, palladium, platinum, in various combinations of mixtures and alloys.


Depending on the complexity of the product, the substrate can be silk-screened onto a single face or both, and real multi-layers made of several layers are also made. The silk-screened resistors are calibrated to the laser to obtain with great reliability and precision (both in relation and in absolute value) any desired value. The SMD components are mounted on the substrate.


High reliability


Thermal Conductivity The ceramic substrate used has high thermal conductivity properties (dissipation), it exceeds the traditional PCBs of 0.5 Watt per cm2 in increments of 100ºC, which is why film circuits are often ideal for power electronics applications.


High operating voltages Ceramic substrates have a very high breakdown voltage compared to printed circuit boards, making them ideal for high voltage applications.


Ceramic transistor insulators 


 Ceramic Insulators can perform various functions:

- Insulator 

- Heat Sink for Active Power Components 

- Mechanical support 


Package                       Insulator dimension   L x H (mm)


TO126/SOT82                     8,8 x 12,0mm

TO218/SOT23                    15,5 x 20,3mm

TO220                                  11,5 x 17,0mm

TO247                                  17,0 x 22,0mm

TO264                                  21,5 x 27,5mm


(thickness = 0,63 / 1mm)


It is also possible to supply custom dimensions 

ALLUMINA matherial characteristics

Some members of the RadioControlli team have more than twenty years of experience in thick film technology. We are pleased to put our know-how at your disposal to provide you with a feasibility analysis and a quotation of your module in no time.

We are able to realize resisitive element high value and for use in high voltage. 

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